Internal thin film fuse

Paul Boughton

AVX Corporation, a manufacturer of passive components and interconnect solutions, has released a new series of fused high CV tantalum SMD chip capacitors with undertab terminations.

The new F98-AS1 Series capacitors feature a lead-frame-less structure with precise dimensions and low stress packaging, an internal thin film fuse that protects against short circuits, and well-established undertab termination technology, which enables high volumetric efficiency and high PCB assembly density. 

Currently available in a 0805 (2012 metric) S case with four ratings (22μF/10V, 33μF/10V, 10μF/16V, and 1μF/35V) and a 0.9mm maximum height, the F98-AS1 Series is the smallest and thinnest SMD fused tantalum product currently available on the market. 

As such, the series is suitable for use in a wide variety of applications in which safety and size are a primary concern, including: automotive, commercial, industrial, and medical applications, and the input/output lines of small power supply circuits, portable gaming devices, and smartphones.

F98-AS1 Series capacitors are rated at 85°C and designed for use in temperatures spanning -55°C to +125°C. The series is also lead-free compatible and RoHS compliant.

Series extensions currently in development include a 0805 (2012 metric) case 47μF/10V capacitor and 10 capacitors packaged in 0603 (1608 metric) M cases: a 1μF/25V component, a 1μF/20V component, 10V components rated for 2.2μF, 4.7μF, 10μF, 22μF, and 33μF, and 16V components rated for 1μF, 2.2μF, and 4.7μF.