Wafer X-ray metrology platform

Paul Boughton

Nordson DAGE's XM8000 Wafer X-ray Metrology Platform takes the capabilities from company's existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.  

The XM8000 provides non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more. In this way the XM8000 can be used as an integral part of the fabrication and packaging of integrated circuits or as part of quality control and product acceptance.

For  ore information, visit www.nordson.com