High-performance connectors allow design flexibility in RF and automotive applications

Paul Boughton

Molex has developed a high-performance connector system designed specifically to enable PCB developers in the video, commercial broadcast and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints.

At the same time it has expanded its connector system for automotive applications, writes Nick Flaherty.

The RF DIN 1.0/2.3 Modular Backplane System features a unique bracket housing design which enables an expansion capability of up to 10 ports for increased orthogonal PCB mating flexibility and still handles signals up to 3GHz.

“System designers are always looking for ways to increase performance yet consolidate space when converging video, data and voice applications,” said John Hicks, product manager at Molex. “The RF DIN1.0/2.3 Modular Backplane System provides them with a sub-miniature form ideal for tight spaces yet still delivering a superior method for routing of RF signals.”

The modular board-to-board system offers multiple options including a standard four port, 75 Ohm contact version or customizable six, eight and 10 ports with 50 Ohm contacts. The DIN 1.0/2.3 interface allows up to 1.00 mm of axial engagement tolerance, providing users with increased flexibility when mating orthogonal PCBs.

The RF DIN 1.0/2.3 backplane system is the only one on the market capable of increasing board-to-board content for DC to 3 GHz frequency applications making it ideal for CATV, communication systems and high-density radio applications. The connectors also feature a push-pull coupling design for quick installation and a plastic housing that engages before the RF contact to prevent damage from stubbing.

Molex has also added a 14-circuit hybrid connection system to its Stac64 product family.

The 14-circuit Stac64 hybrid system comprises a 14-circuit hybrid receptacle connector and mating 14-circuit vertical and right-angle headers to meet the increasing terminal requirements for expanding in-vehicle functionality in automotive and commercial vehicles.

Typical applications include in-car entertainment systems, interior lighting and navigation, power seat and door zone modules, and instrument panel clusters.

“Since its launch in 2006, the stackable nature of the Stac64 system been widely accepted by the major automotive OEMs,” says James Fan, global product manager at Molex. “Unique to the industry, the 14-circuit Stac64 hybrid system is available in all 3 USCAR colour codings, which solves common OEM body- and assembly-polarisation issues.”

Designed originally as a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications, the Stac64 design has since secured new patents relating to the stackable header.

“This design evolution differentiates the Stac64 family from the standard products available on the market today,” said Fan, “resulting in a new product specification for the Stac64 family, as well as a new Design Validation Plan Report (DVPR) worldwide.”

The Stac64 stackable connection system allows OEMs greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30.0A. It also allows the manufacturers to use header assemblies as stand-alone components or to gang multiple headers together to support a large range of signal and power needs for devices and modules.

For more information, visit www.molex.com