Call for papers for the Advanced Engineering forum

Jon Lawson

Last year’s successful Open Forum Programmes saw speakers from IBM, JLR, Siemens, European Space Agency, Silverstone Technology Cluster, Network Rail, Department for International Trade and many more. Advanced Engineering is again inviting exhibitors, visitors, associations and professors to enter submissions for this year’s conference programme. Presentations should give attendees insight into the latest innovations and technologies in their field, highlighting key issues including those related to skills, regulations and market forecasts.

In 2019, Advanced Engineering will run forums focussing on five key industries; Aerospace, Automotive, Composites, Connected Manufacturing and Medical Devices - which has been created to support the new Medical Device Engineering zone being launched this year. With over 70 industry associations and media partners, chosen speakers will benefit from targeted publicity in the run-up to the show. This includes promotion in trade media, social media and on Advanced Engineering’s website, which is viewed around 2.1 million times per month. All conference attendees will also be eligible to claim valuable CPD points.

To submit an abstract, email and include your name, company, contact details and a title and short description of your presentation. The closing date for submissions is June 11, 2019.