The Chomerics Division of Parker Hannifin, a specialist in motion and control technologies, has launched its Cho-Therm HV Series, a new line of thermally conductive interface pads that provide enhanced electrical insulation
This range of materials combines high thermal dissipation performance and electrical isolation with inherent vibration-damping properties. Thermal conductivity spans 1.1 to 3.3W/m-K with breakdown voltages up to 20kV under DC load.
To enhance electrical insulation between high-power components, the Cho-Therm HV Series incorporates robust dielectric layers. Alongside impressive thermal performance, these properties are created to meet the stringent engineering demands of modern automotive and industrial systems. The materials exhibit a dielectric constant as low as -0.05 at 1MHz and a dissipation factor as low as 2.8 at 1MHz.
Kieth McDonald, international director of sales, Parker Chomerics, said, “Cho-Therm HV marks an important addition to our technology portfolio, meeting the thermal management needs of systems where enhanced electrical insulation is paramount. The materials offer superior performance across a broad spread of applications that include automotive electronics and on-vehicle power systems, lighting assemblies, high-voltage sensors and actuators, and electric vehicle charging stations.”
Cho-Therm HV is suited for alternative-energy power-conversion/inversion systems, heavy-duty industrial equipment, and industrial motor controllers. Parker Chomerics designed the materials to provide effective thermal transfer from heat-generating components, such as GPUs, CPUs, and high-power busbars, to heat-dissipating components, such as heatsinks, cold plates, cooling pipes, and vapour chambers.
Additional benefits include minimal outgassing, V-0 flammability compliance under the globally recognised UL94 standard and ultra-low compression force, which simplifies installation. With Shore 00 hardness ratings of 30-35, Cho-Therm HV solutions conform to uneven or textured mating surfaces, preventing air gaps and enhancing thermal contact.
Customers can specify the pads in standard sheet formats for high-volume processing or select custom die-cut configurations tailored to complex geometries. Four RoHS-compliant material variants are available, with Parker Chomerics specialists available to assist with selection. Pressure-sensitive adhesive bonding options are also available where added adhesion strength is required.