The only way to fully inspect the solder joints of BGAs is by X-Ray. Xavis X-ray has a solution for any application from electronics, medical, food and die cast applications.
Its H130-OCT Flag ship model is designed for SMT application. Using Oblique X-Ray and Image Intensifier, the machine has amazing magnification and power.
By utilising the 3D rendering tool, deep analysis can be done of the BGA solder balls.
It is supplied and supported in the UK by Elite 7 Installations Limited.