360 degree EMI shielding

Jon Lawson

Designers concerned with EMI interference can rely on a very small connector that delivers the highest performance.

The new Novastack brand 35-HDP Board-to-Board or Board-to-FPC connectors from I-PEX are designed with industry-high full 360 degree EMI shielding. This full shielding helps designers avoid interference with signals that run through connectors, allowing for greater design flexibility.

The high-data-rate (HDR) capability supports all of the new transmission standards, making them ideal for applications with speeds up to 20 Gbps, including USB-3.1, eDP HBR3, PCIe Gen 3 and 4, and Thunderbolt3.

Novastack 35-HDP connectors are capable of delivering high power with four sets of 2.2A power pins. Their low-profile size, at 0.35mm pitch and a 0.7mm mated height, enables electronics manufacturers to create slimmer devices.

With very small, high-data rate solutions like this, designers have the freedom to focus on their own innovative solutions.

In the NOVASTACK series, I-PEX can offer variation of solutions like 0.4mm and 0.35mm pitches with options for high visibility mating and power pin features.