The companies have established a reproducible process for 3-inch WSC diamond
Element Six (E6) and Orbray have shared the next phase of their partnership, expanding on their joint vision to deliver wafer-scale single-crystal diamond (WSC) for next-generation applications
The companies have established a reproducible process for 3-inch WSC diamond, representing a significant step change in size, uniformity, and manufacturability compared with conventional single-crystal (SC) diamond. Development of larger 4-inch substrates is also underway.
2-inch wafers optimised for epitaxial applications are nearing finalisation, while 2-inch wafer diamonds for thermal bonding applications are being prepared for volume production at E6’s chemical vapour deposition (CVD) facility in Gresham, Oregon.
Since establishing the partnership, E6 and Orbray’s efforts have focused on advancing wafer size and manufacturing maturity to accelerate the broader adoption of WSC diamond across 6G wireless components, power and RF electronics, sensing, thermal management, and quantum technologies.
These developments represent a transition from Research and Development to scalable implementation, with the collaboration between companies shifting focus to refining production processes to support operational ramp-up for volume manufacturing at an industrial scale.
Siobhán Duffy, CEO of E6, said, “Our partnership with Orbray was built on shared strengths in innovation, quality and technical expertise. The progress we are making together shows how those core competencies translate into tangible delivery, as we move closer to pioneering wafer-scale single crystal diamond at the quality and volumes our industrial customers need.”
Riyako Namiki, president and CEO at Orbray, said, “The milestones achieved so far represent meaningful steps in the journey we started, together with Element Six, to expand commercial use of single crystal diamond, advancing material capability alongside the manufacturing volumes required to support most demanding applications.”