Master Bond has introduced a thermally conductive potting compound called EP30AOHT that has a balance of performance properties, including high temperature resistance, and excellent electrical insulation.
The epoxy based potting compound has good thermal conductivity of 10 BTU•in/ft2 •hr•°F. Moreover, EP30AOHT excels also as a thermally conductive adhesive forming durable rigid bonds with impressive compressive strength of 25,000 psi.
EP30AOHT has a low coefficient of thermal expansion of only 27 in/in x 10-6/°C and excellent flowability making it an ideal encapsulant/potting compound as it makes good thermal contact for heat dissipation to the heat sink.
Curing at room temperature or in 1-2 hours at 90°C, the thermal compound forms adhesive bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents maintained over a wide temperature range of -50°C to 205°C. EP30AOHT is recommended for use in the electronic and electrical industries.
Where a potting compounds superior heat transfer is a must, yet good electrical insulation and environmental protection of the thermal transfer material are also required.
For more information, visit www.masterbond.com
