Semi-aqueous solvent blend removes difficult flux and paste residues

Paul Boughton

MICRONOX MX2302 from Kyzen is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and microBGA packages.

The material has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc) and metal layers.
AQUANOX A4638 was developed to rapidly dissolve water-soluble polar flux residues and exhibits a low surface tension. A4638 is combined with Kyzen’s revolutionary inhibition technology to provide superior material compatibility. An engineered electronic assembly and advanced packaging cleaning agent, this aqueous solution is designed to remove flux residue from flip chip and low clearance components. A4638 is non-hazardous, biodegradable and contains no CFCs or HAPs.
Both MICRONOX MX2302 and AQUANOX A4638 are available in one, five, and 55 gallon containers.

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