Hamamatsu Photonics introduces a back illuminated 16 channel photodiode array (PDA), designed for use in X-ray non-destructive testing applications.
The S11299 uses flip-chip technology that allows the PDA to receive scintillation light from the back side of the array. This flip-chip approach reduces the need for gold bond wires and junction layers on the light input side, vastly reducing the risk of wire bond damage during scintillator mounting.
The S11299 uses a new slender board design, with a vertical height of just 10.2mm. This allows for long and narrow arrays to be constructed. Additionally, the S11299 is suitable for dual energy imaging, by combining two arrays with differing scintillator thicknesses in a vertical structure. The existing S11212 series is ideal for this and various configurations can be designed to match any application requirement.
The S11299 series shows a large improvement in uniformity compared to the popular conventional S5668 array that has been in production for many years. The new design also makes the new series highly reliable, by reducing the risk of bond wire damage.
This series of PDAs is set to make a large improvement to X-ray non-destructive testing and security applications especially baggage scanning.