Semikron has introduced the SemiX5 range to complete its SemiX product family between 50 and 350kW for 650, 1200 and 1700V applications. The baseplate module features rugged power terminals with 17mm height and press-fit contacts for a low cost solder-free assembly of the gate driver. A significantly reduced stray inductance allows for higher operating safety and lower module losses, supporting highly efficient solutions in UPS, solar, power supply and motor drive applications.
The press-fit contacts provide fast and solder-free driver board assembly, increasing reliability and reducing mounting cost. The housing features rugged moulded power terminals for excellent mechanical stability, making the SemiiX5 ideal for robust and compact inverters at optimised system costs. The internal layout is optimised for high thermal conductivity and a homogenous temperature distribution, which reduces the risk of hotspots by lowering the thermal coupling between adjacent chips. As a consequence, the operating temperatures are reduced, thus enhancing product lifetime.
The newly designed internal layout also provides higher versatility for different architectures and topologies, giving room for a large power range and a broad variety of sixpack, NPC, T-NPC and customer-specific topologies. The superior heat management, together with the integration of latest chip technologies allows the new family to be offered in the most comprehensive product range for 2-level and 3-level configurations, addressing a wide range of applications in UPS, solar, power supplies and motor drives.