New one component glob top adhesive

Jon Lawson

Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat-curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. It meets NASA low outgassing specifications and is serviceable from -80°F to +600°F [-62°C to +316°C]. This adhesive forms high strength bonds to a wide variety of similar/dissimilar substrates such as metals, ceramics, plastics, composites and various circuit board materials.

EP17HTND-CCM is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions. It has a high volume resistivity of more than 1015 ohm-cm at 75°F and over 1012 ohm-cm at 400°F. Its thermal conductivity is 9-10 BTU•in/ft2•hr•°F [1.4423 W/(m•K)] at 75°F. Also noteworthy is its ability to resist many chemicals including acids, bases, salts, fuels, oils and many solvents.

Formulated for various electronic applications, EP17HTND-CCM cures readily in 1-2 hours at 350°F [175°C] with a relatively low exotherm upon curing. It can be dispensed from a syringe, either manually or with an automatic dispenser. It is available for use in common size syringes ranging from 10 cc to 30 cc. For storage simple refrigeration at 40-45°F is recommended.


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