New line of solderless vertical launch connectors

Louise Davis

Pasternack has introduced a new line of solderless vertical launch connectors designed for high-speed networking, high-speed computing and telecommunications applications.

The new series of 12 models that provide VSWR as low as 1.3:1 and maximum operating frequency of up to 50 GHz, depending on the model. They feature a reusable clamp attachment and can be used for microstrip or stripline. They are offered in male and female versions, covering 2.4mm, 2.92mm and SMA interfaces, and all models provide solderless installation. They feature a stainless steel outer conductor, gold-plated beryllium copper centre contact and Polyetherimide (PEI) insulators. They are suited to high-speed backplanes, signal integrity measurements, semiconductor verification boards, multi-channel tests and SERDES applications.

“The VSWR of these new vertical launch PCB connectors minimises the performance tradeoff compared to end launches. This allows users to take advantage of additional PCB real estate and allows for easier access for their test cables,” said Pasternack’s Dan Birch.