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New IO-Link master development kit

28th November 2018


Renesas Electronics has introduced a new IO-Link master development kit to accelerate IO-Link-based application development for industrial networked devices in a smart factory.

 
The development kit includes a board and pre-qualified sample software provided by TMG. The board has eight IO-Link connecters allowing developers to immediately connect IO-Link devices and start the evaluation process. The easy-to-use development kit contributes to shorter prototype-to-production process time and helps to reduce the development burden for engineers.
 
The solution is supported by two CPUs that operate independently and simultaneously with a large built-in SRAM. The eight-port IO-Link Master is controlled by one CPU; the other CPU features an R-IN engine architecture and supports Industrial Ethernet communication to the upper layers, such as PLC, without any external microcontroller, microprocessor, or memory like DDR. Integrating the two CPUs in a small 12mm x 12mm LFBGA package also helps with designing compact PCBs.

 







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