New approach to intelligent bonding and fixing

Paul Boughton

Industry’s demands on high-tech bonding systems are increasing. Today, numerous safety components or entire assemblies are optimally connected using only adhesives. To create connections that are reliable for the various processes, the limits of conventional pressure-sensitive adhesives have to be surpassed. Besides, other bonding methods no longer represent an adequate alternative.

With their new product series DuploTEC SBF (Superior Bonding Films) the Lohmann ‘bonding engineers’ have provided the answer to these industrial challenges. Within the scope of structural bonding, innovative products that are much stronger than conventional pressure-sensitive adhesive connections have been developed. These products are suitable for numerous industrial applications; particularly when quick and easy handling is required for process reliability. In addition, DuploTEC SBF bonding films not only satisfy the high safety and environmental requirements of modern industry, but also offer enormous freedom of design – even for bonding on the smallest surfaces. Within the new series Lohmann distinguishes between three different technologies that are referred to as Topaz, Onyx and Amber. All bonding films in this series are thermally activated, but differ – depending on the requirements – in their performance.

The Topaz technology represents bonding films that are activated at low temperatures and are thus suitable for quick adhesion. This technology combines high adhesive strength and flexibility with a fast process.

The Onyx technology is suitable for processes that require extreme adhesive strength and high stability. In addition, it combines the advantages of pressure-sensitive adhesion with those of structural bonding.

If temperature-sensitive components – for example, on basis of elastomers – have to be joined quickly and reliably, then the Amber technology is the right answer. The Amber products become activated at ambient temperature and offer very high initial adhesive strength.

The DuploTEC SBF series is suitable for various industrial applications. For example, in the electronics industry the Topaz technology has already been successfully introduced. Nowadays, mobile phones, tablets and other electronic devices have larger displays, but reduced frame widths. Thus, the adhesive surface becomes smaller and smaller. At the same time, customers’ requirements towards strength and tightness are increasing; waterproof devices, for example, are becoming more and more popular.

Hence, Lohmann needed to develop new and innovative bonding solutions. The Topaz technology is especially suitable for these applications. Customers get a high-precision die-cut part suitable for their individual frame geometry either on roll or as sheets.

Adhesive films can also be applied to individual building parts prior to the final bonding process. Here, a high-strength bonding is achieved after the hardening process. In most cases pressing times of just a few seconds are sufficient. But also IR-radiation or ultrasound procedures can be used to activate the structural bonding characteristics of the adhesive films. Through this, the adhesive strength is much higher than usual and allows for the smallest surfaces to be adhered. The newly developed Polyurethane system stays flexible even after hardening. Thus, industry demands for cold shock resistance and impact strength are guaranteed.


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Pic: DuploTEC_Plate.png

Caption if needed: The DuploTEC SBF series is suitable for various industrial applications, including many within the electronics sector

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