High temperature adhesives and encapsulants for applications up to +250°C

Paul Boughton

DELO Industrial Adhesives presents new one-component epoxy resins based on anhydrides with an operating temperature range of -65 °C to +250 °C. They are particularly suitable for bonding or encapsulating sensors and semiconductors.

Their high temperature- and chemical-resistance and low thermal expansion coefficient of 11ppm/K or less can be attributed to their extremely dense crosslinking. This gives them a clear advantage over aminic adhesives.

In addition, the newly developed adhesives also have the impressive characteristic of remaining strong and stable in temperatures up to +250°C. That is 70°C more than previous standard products based on anhydrides.

Even after 500 hours of storage at +250°C they exhibit a tensile strength of 50 MPa. As well as a high temperature-resistance, the adhesives also have a high bond strength at temperatures above +200°C. After storage for 500 hours at +250°C, a compression shear strength of 8MPa was achieved at a test temperature of +220°C.

These adhesives are suitable for applications in which bonded or encapsulated components must withstand high temperatures and aggressive media, as is increasingly called for in areas such as the automotive, power electronics, or oil and gas industries.