OT2 is Cobar’s latest halide and halogen-free solder paste technology. The paste’s optimised rosin based chemistry offers the best printing and wetting properties in Pb-free.
The solder paste is designed to achieve printing speeds up to 250mm/s for the most demanding throughputs.
The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.
The new Cobar WW50 water soluble solder paste compatible with the following alloys: Sn62, Sn63, SAC305 and SN100C, all with Type 3 powder.
The rosinous halide-free nature of WW50 , with paste rheology, has solder-ability and water wash-ability conferred by carefully selected surface chemistry and activators. With the new WW50 branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Furthermore, the residues can be easily removed with de-ionised water.
For more information, visit www.balverzinn.com or www.cobar.com