Enclosures for conduction cooling and rear I/O

Paul Boughton

VadaTech has developed a complete ecosystem of boards and chassis in the MicroTCA architecture that is conduction-cooled as well as a new design of chassis for rear I/O systems to address customer concerns with the use of the enclosures.

Designed for rugged applications, the conduction cooled products include Air Transport Racks (ATR), MicroTCA Carrier Hubs (MCH), Power Modules, and Advanced Mezzanine Cards.

Compliant to MicroTCA.3 (Hardened Conduction-Cooled MicroTCA) specification, the boards and chassis come in various sizes and formats. The MCH, which acts as a shelf controller, features a 400 MHz RISC CPU for high performance and low latency. The Power Modules provide true hot-swappability in a dual 10-36V input and outputs of up to 800W. They also have dual Intelligent Platform Management Interface (IPMI) and two banks of 256K Flash for redundancy. Several of VadaTech’s Advanced Mezzanine Cards (AMCs) are in the conduction-cooled format.

The VadaTech ATR racks come in ½ and ¾ short sizes with long and tall versions also offered. Customized chassis and module solutions are available.

Vadatech has also developed an 8U MicroTCA.4 chassis designed for High-Energy Physics and other applications that require rear I/O. The chassis features full redundancy, including dual fan trays, dual MicroTCA Carrier Hub (MCH) slots, and quad Power Module (PM) slots.

VadaTech worked to specifically address customers’ concerns with other MicroTCA.4 chassis in the marketplace, including fan tray alignment, chassis weight and cable management. The VT811 chassis features a light-weight aluminum construction with integrated cable ducts below the card cage. This allows the cables to be easily protected and routed to the rear of the chassis. The fan trays use Teflon strips which make insertion/extraction smoother and easier. The trays also have shrouded blind-mate connectors for both the male and female ends, which prevent damage and ease guided insertion.

The VT811 chassis has a 30-layer impedance controlled backplane with slots for 12 double-wide AMC modules in the mid-size, plus 2 MCHs, and 4 PMs. The clock traces are laid out to give equal track length from MCH to each AMC slot, easing latency equalization.  The rear of the enclosure allows for 12 double-wide Rear Transition Modules (RTMs) to be inserted.   The fan trays are arranged with sixteen 2in fans each above and below the card cage in a push-pull configuration.  The smaller, powerful fans ensure each slot gets optimal airflow, avoiding hot spots.

Other features of the VT811 chassis include radial I2C bus to each AMC, an integrated and pluggable JTAG Switch Module (JSM), and Telco Alarm.  Ports 2-3, 12-15 and 17-20 are connected among the slots per the MicroTCA.4 recommendation.

For more information, visit www.vadatech.com