Electrolube has introduced a new range of gap-filling products designed for high thermal performance. GF400 is a two part, liquid silicone-based gap filler, which can either be cured at room temperature or accelerated with heat. Following cure, it forms a low modulus elastomer that prevents the ‘pump-out phenomenon’, ensuring minimal degradation of effective heat dissipation.
Thermal gap fillers are widely used for mobile and touch screen applications, however, the GF400 range is extremely adaptable and can be used in a multitude of applications from printed circuit board assembly and housing electronic components discretely to automotive electronics, including HEV and NEV batteries, power electronics, LEDs and fibre optic telecoms equipment.
GF400 is soft and compliant, making it ideal for low stress applications, and provides a wide operating temperature range between -50 to +200°C. It’s also low viscosity, enabling easier dispensing, and provides high thermal conductivity of 4.0 W/m.K. The GF400 has a straightforward mix ratio of 1:1 and a fast cure time of 20 minutes at 100°C, vastly increasing throughput. Alternatively, the gap filler can be cured at 25°C for 12 hours or 90 minutes at 60°C. The new thermal gap filler is UL94 V-O approved and has excellent dielectric strength of 9 kV/mm.
Ron Jakeman, Electrolube’s Managing Director commented, “We are very pleased to introduce the new GF400 range to the market. It’s an incredibly versatile product and we have received some very interesting enquiries, which, in turn, has led to the development of a 50ml version. We will officially launch the GF400 at Productronica in November, alongside our new range of UV Cure conformal coatings, and anticipate a lot of interest in the new gap fillers due to their all-round capabilities and excellent performance.”