Processors are increasingly smaller, more powerful and more economical. A good example is Intel's Next Unit of Computing (NUC) system. This system, developed for consumer applications, combines many PC functions on a baseboard approximately 10 x 10cm in size.
To extend the benefits of the system to industrial applications, the SDT.03 working group of the SGET e.V. standardising consortium has developed and published a specific embeddedNUC standard as a foundation.
The standard takes into account the interfaces relevant to industrial applications, the long-term availability of processors and other electronic components and failsafe, fan-less conduction cooling.
Small and powerful PC units can now be used as decentralised control and monitoring units in automation systems. Pentair now offers its first compact Schroff case with an integrated cooling solution and compliant with the new standard.
As a member of the standardisation consortium, Pentair experts played an active role in the SDT.03 working group.
In particular, Pentair contributed its know-how in conceptual case design and effective passive cooling. The specification defines not only the electronic parameters concerning connectors, power supply, interfaces etc. but also mechanical aspects such as the size of the board (101.60mm x 101.60mm) with the fixing holes and the heights and positions of the electronic components on the front and rear sides of the board.
The basic dimensions (width and depth) of a case are determined by the board size. The height of the case remains variable, since it has to be adapted to the height of the electronic components and to the conduction cooling. Similarly, cutout locations on the front or rear of the case for connectors etc. remain undefined as these depend on the application. The defined temperature range for operation lies between 0 and +60°C or extended from -40 to 85°C.
Image caption: Schroff embeddedNUC case for small, high-performance systems in decentralised automation