Dual cool package improves power density

Paul Boughton

Fairchild Semiconductor has expanded its Dual Cool packaging technology to mid-voltage PowerTrench MOSFETs to improve power density and performance in 40-100V DC-DC converter designs.

Dual Cool is an industry-standard pin-out package with top-side cooling that incorporates new packaging technology which enables additional power dissipation through the top of the package. This gives 60 per cent higher power dissipation capability than standard PQFN packaging when a heat sink is mounted.

The silicon technology advancements, paired with the Dual Cool technology, provide higher switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP. [Page Break]

Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60V FDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications. The 80V parts have the industry’s lowest RDS(ON) by approximately 35% as compared to competitive solution with same voltage rating.

FDMS8320LDC (40V)
·      Max RDS(ON) = 1.1mΩ at VGS = 10V, ID = 44A

·      Max RDS(ON) = 1.5mΩ at VGS = 4.5V, ID = 37A

FDMS86500DC (60V)
·      Max RDS(ON) = 2.3mΩ at VGS = 10V, ID = 29A

·      Max RDS(ON) = 3.3mΩ at VGS = 8V, ID = 24A

FDMS86300DC (80V)
·      Max RDS(ON) = 3.1mΩ at VGS = 10V, ID = 24A

·      Max RDS(ON) = 4.0mΩ at VGS = 8V, ID = 21A

FDMS86101DC (100V)
* Max RDS(ON) = 7.5mΩ at VGS = 10V, ID = 14.5A
* Max RDS(ON) = 12mΩ at VGS = 6V, ID = 11.5A

For more information, visit www.fairchild.com