Pressure sensors: aid easier development

Paul Boughton
GE Sensing & Inspection Technologies is releasing 10 pressure-sensing MEMS (micro-electro-mechanical system) die families from the company's robust suite of sensors for qualified volume OEM customers. The die allows OEMs to integrate pressure sensing cost-effectively into an existing device or instrument without having to invest in a large-scale MEMS foundry. These products include specialised dies for healthcare, transportation, industrial and process control applications.

Brian Wirth, MEMS global product manager at GE Sensing & Inspection Technologies, comments: "This marks the first time GE has offered these lines of high-stability pressure-sensing die for general sale. This reflects our commitment to serve an expanded OEM sensor market by offering these proven products at cost-effective pricing."

The ten families of sensing die are in pressure ranges and sizes to fit most OEM sensor applications. Pressure ranges are available from 0-10 inches of water (25mbar) up to 10000psi (25bar) in absolute, gauge, differential or sealed gauge versions. Dies are also offered with or without glass constraint to enable customers to isolate the sensing die and meet dimensional height requirements for existing packaging.

For example, the P161 and P165 die families are intended for healthcare catheter tip pressure sensors. These are produced using GE's proven Silicon Fusion Bonding process, which results in an ultra-small 675micron width die for catheter applications. Also released is the P1302 high-stability, high-sensitivity pressure die. The P1302 10inch H20 low-pressure die is said to have been an industry benchmark for applications that require high sensitivity (typically 75mV), high overpressure (20-times rated full scale), accuracy better than +/-0.5 per cent of full scale, and superior isolation from mounting affects.

GE also produces custom versions of pressure sensing dies and provides a foundry service for process-ready products.

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