Solder alloy improves tensile strength

21st February 2013

SJ7 solder alloy from Almit Technology Ltd is characterised by its significant mechanical advantages over conventional tin-lead solders.

SJ7's resultant ability to deliver a superior performance under highly challenging conditions is currently driving its widespread adoption in aerospace and military applications.

Extensive testing has confirmed the paste's ability to offer manufacturers improved tensile and creep strength properties over traditional tin-lead solders at both room and elevated temperatures.

During testing in which pieces were held under a constant temperature of 100degC, SJ7's recorded time to rupture exceeded 4,500 hours, compared to tin-lead's best time of 150 hours.

In addition, SJ7 also exhibited impressive wetting capabilities and exceptional yield for significantly higher throughput. Meanwhile, a highly refined grain structure also means that during thermal cycling, Mean Time Before Failure is greatly increased for manufacturers using SJ7.

Available in both solder paste and wire form, Almit SJ7 displays excellent printing, slump and reflow properties.

The high strength solder paste is supplied with a Rosin Mildly Activated (RMA) Flux and, notably, does not require manufacturers to alter existing tin-lead profiles. For optimum operational flexibility, the solder wire is available in diameters down to 0.5mm, enabling use with small components.

The SJ7 wire is also supplied with Almit's celebrated KR-19SH RMA flux. Both SJ7 products can be effectively cleaned with designated solvent and semi-aqueous cleaning systems.

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