Thickness and composition metrology in ultra-thin structures

Paul Boughton

Thermo Electron Corporation has evolved its Theta300 thin film research tool to manage the transition of new gate dielectrics and other thin structures from development into production.

Thermo's patented parallel angle resolved X-ray photoelectron spectroscopy technique produces accurate and repeatable measurement of thickness and composition in ltra-thin structures. The new fully automated Theta 300XT tool features twin loadports and full host integration and pattern recognition for measurement of product wafers.
Theta300XT features 200mm and 300mm wafer mapping of thickness, elemental and chemical uniformity, coupled with non-destructive depth profiling to determine interface chemistry. This unique capability allows a metrology of thickness and composition that relates directly to device electrical performance.
With the development of this new aat-line' tool, Thermo is supporting the current and future needs of the semiconductor and nanotech industries as they introduce novel materials and ultra-thin structures. Semiconductor device speed can no longer be improved by simple scaling.

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