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Phase change materials offer alternatives to thermal greases

TPM350 has a thermal conductivity of 3.5W/m.K and becomes workable at approximately 50°C

Free feasibility study for outsourced electronic design

Ensure that the most suitable designs employing the very latest technologies are created

Stretchable electronics: out of the lab and into the market

While the latest electronic components continue to push the boundaries of performance, there are many that now see Moore’s Law reaching its ultimate limits. James Hayward reports

Latest signal analysis tool includes power and PCIe 4.0

Enables designers to quickly assess power delivery decisions early in the design cycle

Emulation platform scales up to 15 billion gates

Combines to link multiple emulators to data centre processing

High performance resins

Meet requirements from potting and sealing to dipping, including exceptional electrical and thermal characteristics, flame retardancy and resistance to chemicals and fuels

Wide aspect ratio display features HD resolution and IPS technology

Suited for harsh and rugged environments, the Rugged+ module is also highly resistant to electro-static discharge, mechanical shock and vibration

Think thin for industrial computing applications

For application in limited-space environment (such as digital signage, healthcare, surveillance, and power and energy industry

Ultra-slim supercapacitor for wearable applications

Suitable for use in wearable devices, mobile electronics, smart cards, electronic paper devices

Ultra-compact crystal unit

Preserves ESR characteristics normally lost when miniaturised

Optical blood-flow sensor

Potential mHealth applications utilise earbuds and other devices to sense stress levels, help prevent dehydration and avoid altitude sickness

Golf rangefinder wearables

Voice Caddie GPS Watch and Band take advantage of compact, low-cost location detection components

Three panel tab assembly tips

Expert advice on panel tab assembly

High-speed deposition process outperforms current techniques for making displays

Spatial atomic layer deposition can deliver semiconductor layers with better performance than physical vapour deposition

Advanced analytics and debug

RISC-V-based SoCs enter the mainstream as need for commercial support with production-quality debug, analysis and bring-up tools become critical

Boosting design, test and simulation

Siemens shakes up electronic design with Mentor Graphics deal

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