Article Archive

Article archive

European Electronics Engineer July 2009

Meet the challenge of collaborative management in embedded design

Collaboration is not new in the electronics industry, but logistics remains a hurdle to allowing engineering organisations to efficiently share up-to-date code and assets. Tony Smith looks at the issues in managing collaborative design of embedded systems

Custom mixed signal ICs can be more economical than you may think

Custom chips can offer reduced power consumption, compared with a collection of standard parts. Paul Double reports

Taking the brakes off developing machine-to machine applications

Combining high-level design with speed and flexibility is the key to machine-to-machine development. Fabien Fleutot reports

Compact, rugged high capacity SBC for embedded OEM work

Lisa Duckett outlines the benefits and features of a new single board computer designed for embedded OEM applications

Replacing PCs and SBCs with a low power embedded platform

Designing a PCB for an embedded module can give significant gains in system design, production and, particularly, running costs over a commercial PC board or single board computer, says Richard Bethell

Latest PCB technology boosts power electronics performance

Stephan Ruhnau explains how to transmit loads of 150A@1000V with wires up to 50mm2 straight to high current PCBs

Mass interconnect systems help protect company investment

Mass interconnect systems provide the critical connection between the tester and the unit under test. Elizabeth Wise reports

Top-down approach to the simplification of PSU selection

Stephen Dodson looks at the latest issues in selecting the right power supply

Transceiver targets low cost antenna diversity in ISM band applications

Nick Dutton looks at a new single chip transceiver and controller that supports antenna diversity in low cost, low power wireless designs

Connectors: for space, medicine and test and measurement applications

Serge Buechli looks at how connectors are used for high-tech applications in markets such as medicine, test and measurement and broadcast

Mobilisation of embedded applications

The new but already widely established Qseven standard is 59 per cent smaller when comparing to a COM Express basic module

MEMS: developers learn the lessons of the fabless chip

As product developers look to MEMS devices to enable significant new features, the technology and business of MEMS is following paths already familiar to the semiconductor industry. Tony McKie reports

High level modelling language for mission and safety-critical systems

Matthew Hause looks at how a standard high level modelling language can help in the design and development of mission critical systems as they become standardised

Illumination design program delivers enhanced optimisation

Michael Zollers highlights the new features and enhancements of an illumination design, analysis, and optimisation software package

Wireless microcontroller technology plays key role in energy efficiency

System helps reducing business’ heavy electricity consumption levels; it has allowed the management to do in depth analysis of electricity consumption throughout the day

ST launches world's thinnest accelerometer

LIS302DLH is a high-performance high-stability 16-bit device that is only 0.75mm high

Battle heats up for USB3.0 chips in new markets

Both NEC and Texas Instruments have announced controllers for the 5Gbit/s USB3.0 standard, with devices starting to ship this month

Tool changer eliminates the need for multiple robots

Staubli is introducing the MPS 32 automatic tool changing system that enables one robot to perform multiple tasks within a production cell

Pressure sensors: aid easier development

Pressure-sensing MEMS dies offer OEMs a cost-effective route to the development of new or upgraded pressure sensors

Pages