Article archive
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Collaboration is not new in the electronics industry, but logistics remains a hurdle to allowing engineering organisations to efficiently share up-to-date code and assets. Tony Smith looks at the issues in managing collaborative design of embedded systems
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Custom chips can offer reduced power consumption, compared with a collection of standard parts. Paul Double reports
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Combining high-level design with speed and flexibility is the key to machine-to-machine development. Fabien Fleutot reports
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Lisa Duckett outlines the benefits and features of a new single board computer designed for embedded OEM applications
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Designing a PCB for an embedded module can give significant gains in system design, production and, particularly, running costs over a commercial PC board or single board computer, says Richard Bethell
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Stephan Ruhnau explains how to transmit loads of 150A@1000V with wires up to 50mm2 straight to high current PCBs
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Mass interconnect systems provide the critical connection between the tester and the unit under test. Elizabeth Wise reports
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Stephen Dodson looks at the latest issues in selecting the right power supply
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Nick Dutton looks at a new single chip transceiver and controller that supports antenna diversity in low cost, low power wireless designs
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Serge Buechli looks at how connectors are used for high-tech applications in markets such as medicine, test and measurement and broadcast
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
The new but already widely established Qseven standard is 59 per cent smaller when comparing to a COM Express basic module
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
As product developers look to MEMS devices to enable significant new features, the technology and business of MEMS is following paths already familiar to the semiconductor industry. Tony McKie reports
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Matthew Hause looks at how a standard high level modelling language can help in the design and development of mission critical systems as they become standardised
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Michael Zollers highlights the new features and enhancements of an illumination design, analysis, and optimisation software package
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
System helps reducing business’ heavy electricity consumption levels; it has allowed the management to do in depth analysis of electricity consumption throughout the day
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
LIS302DLH is a high-performance high-stability 16-bit device that is only 0.75mm high
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Both NEC and Texas Instruments have announced controllers for the 5Gbit/s USB3.0 standard, with devices starting to ship this month
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Staubli is introducing the MPS 32 automatic tool changing system that enables one robot to perform multiple tasks within a production cell
Submitted by Anonymous (not verified) on Thu, 02/21/2013 - 21:38
Pressure-sensing MEMS dies offer OEMs a cost-effective route to the development of new or upgraded pressure sensors
Pages