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Combining power and signal technologies
Providing power electronics design engineers with a high power, thermally efficient hybrid solution, TT Electronics and BI Technologies has combined its small signal and power hybrid technologies to develop an integrated control and power handling hybrid solution. While conventional assemblies require larger packaging to provide adequate thermal management, BI technologies' hybrid module combines thermally conductive ceramic substrates with discrete components or bare die through the use of vacuum low flow die attach, providing a smaller, more efficient solution than comparable products. Typical applications for the custom hybrid modules include motor drives, power amplifiers and power conversion. The hybrid module is capable of handling power to 100A, with a voltage rate of 1000V. BI Technologies is on the DSCC Qualified Manufacturer List of hybrid electronics suppliers (QML). All qualified products meet the stringent requirements of MIL-PRF-38534, Class H. |
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