Delo Industrial Adhesives has applied its know-how in the field of bonding in electronics and developed and qualified very fast, heat-curing epoxies especially tailored to the requirements of electronic assembly processes.

The heat-curing epoxy resin – Delo Monopox MK055 – allows high-strength bonding of miniature components like diodes, sensors or housings. It features:

• Reliable adhesion to plastics, metals, ceramic and silicon – even under hard conditions such as temperature, media influence etc.
• Fast curing (6 to 9s with thermode)u  Curing at moderate temperatures (≥90°C at prolonged curing time)u  Ion purity (semi-conductor grade)
• Utmost quality and long-term stability

The adhesive passed demanding tests in different applications like temperature shock (-40 to 105°C), storage at 85°C/85percentrh and 40°C/100percent r h.

Additionally, Delo Monopox MK055 was optimied for different media influences like from acetone, diesel, oil, gasoline, etc. And it shows excellent adhesion to plastics commonly used in electronics. A good indicator is the compression shear strength. The bonding reaches good values after 14 days storage at 85°C and 85percent r h.

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DELO Industrial Adhesives is based in Landsberg, Germany. www.DELO.de