In response to the growing demand for affordable high-end X-ray computed tomography (CT) in the semiconductor and electronics industries, phoenix|x-ray has introduced its new microme|x CT.

The high-resolution computed tomography system combines proven high-resolution 2D and 3D X-ray inspection technology in one system.

The new microme|x CT comes standard with an ultra high-performance 180 kV high-performance X-ray tube for sub-micron feature recognition <1µ and a high-resolution

2M pixel digital image chain with 16-Bit image processing and high-contrast 24-in flat display. The microme|x CT is particularly suited for the inspection of high-contrast features and, due to its 180 kV X-ray tube, high-absorbing objects.

It provides a total magnification of up to 18 000x and oblique angle views of up to 70 degrees at any position and 360-degrees rotation around any point of the entire inspection area covering 460mmx360mm or 610mmx560mm (without rotation table) for samples up to 680mmx635mm weighing up to 10kg.

Outstanding image quality and great versatility make the microme|x CT the new inspection solution of choice for the manual and automated X-ray inspection (AXI) of a wide range of components in the semiconductor and electronics industries.

Enter 41 or at www.engineerlive.com/eee

Phoenix|x-ray Systems + Services is based in Wunstorf, Germany. www.phoenix-xray.com