Sputtering is a vacuum process used to deposit very thin films on substrates for a wide variety of commercial and scientific purposes. It is performed by applying a high voltage across a low-pressure gas to create plasma.

During sputtering, energised plasma ions strike a ‘target’, which is composed of the desired coating material. Atoms from that target are dislodged by the impact of the ion and ejected from the surface with enough energy to travel to and bond with the substrate.

Because the bond is made at the atomic level, sputtered coatings are nearly impossible to peel, break, or flake away from the substrate.

Magnetron sputtering cathodes use powerful magnets to confine the plasma to the region closest to the ‘target’. This condenses the ion-space ratio, increases the collision rate, and thus improves deposition rate. Angstrom Sciences Onyx-series of magnetron sputtering cathodes have further advanced sputtering efficiency. The only magnetron sputtering cathodes that utilise profiled magnets, Onyx magnet arrays can be custom designed to provide high target utilisation, increased throughput, or improved film uniformity depending upon process requirements.

Angstrom Sciences Inc is based in Duquesne, PA, USA. www.angstromsciences.com