Engineers from BAE Systems have created a way to design futuristic circuit boards, by turning complex conventional two-dimensional circuit boards into robust three-dimensional structures. Circube is a design and manufacturing service that creates products tough enough to withstand the hostile conditions and demands of the space environment.

Space qualified by NASA, ESA and CNES, the technology is already in use in a range of space vehicles such as satellites and comet chasers. The product takes up less space than traditional circuit boards and is particularly suited to medical applications, such as cameras for endoscopes.

Cubes consist of stacked miniaturised circuit boards that are encapsulated and connected by laser-patterned metal on the edges of the cube. Circube can produce modules that are up to 75percent smaller and 80percent lighter than traditional circuit boards, making it suitable for applications where space is limited and weight reductions are crucial to efficiency – such as on aircraft and other autonomous vehicles.

Circube provides low-cost, high-performance packaging that developers claim is ‘future proof’ thanks to the fact that outdated parts can simply be removed and replaced. Additionally, engineers have developed a ‘pluggable’ device that allows the user to unplug and exchange cubes to quickly and efficiently update or modify the system or to create variants.

Nick Chandler, deputy head of the Sensor Technology Department at BAE Systems' Advanced Technology Centre, says: “Circube technology meets growing demand from a range of industries for higher levels of integration, reduced costs and faster product delivery. The approach is so versatile that almost any type of component or package can be used on any part of the device – whether inside the cube or on the cube surface. The cubes can also be mounted on boards alongside other components.”

The flexibility of Circube means that engineers are able to develop a system with the customer’s specific needs and challenges in mind.

The bespoke finished result is said to enable the customer to benefit from unprecedented levels of performance for the lifetime of the product.

BAE Systems has partnered with 3D Plus to develop the technology. 3D Plus is described as the leading 3D electronics packaging company in Europe. Together, the companies have worked to improve the sophistication of the technology and to adapt it for a range of industry – from avionics and automotive, to medical and consumer electronics.

For more information, visit www.baesystems.com