Intelligent module for embedded connectivity

Jon Lawson

Supporting the ongoing proliferation of Internet of Things (IoT) technology, the engineering team at Solid State Supplies is able to assist system developers in the quick and simple implementation of wireless connectivity with minimal expense, through use of the latest system-on-module (SOM) solution from Digi.

Possessing an elevated degree of integration, the ConnectCore for i.MX6UL has dimensions of just 29mm x 29mm x 3.75mm - making it significantly smaller than other SOMs currently on the market. This compactness allows it to be placed in the most space constrained of application environments.

At the heart of each of these modules is an NXP i.MX6UL application processor with an energy efficient, performance-optimised 32-bit ARM Cortex A7 core. The module has an expansive connectivity resource, which comprises pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) and Bluetooth 4.1, plus dual-Ethernet. It can be offered with up to 2GB of built-in NAND Flash memory and 1GB of DDR3 memory.

Employment of Digi’s proprietary SMTplus surface mount mechanism for either LGA or castellated edge interconnection results in enhanced design flexibility and greater convenience.

The module also incorporates Digi’s TrustFence functionality, which furnishes engineers with a highly effective security framework that facilitates the process of protecting the connected devices they are developing from potential security threats.

Among the various features included are local file system, access-controlled internal/external ports, enterprise-level data encryption, tamper proofing and device integrity monitoring.

The module’s operating system uses the Linux Yocto open source platform. A -40°C to +85°C operational temperature range is supported. To accompany the modules, and further aid design and deployment, Solid State Supplies has ConnectCore for i.MX6UL starter kits and development kits. These items contain all the hardware necessary for preliminary evaluation and prototyping.