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Compact system-on-module uses Xilinx Zynq UltraScale+ MPSoC

4th April 2016

Posted By Paul Boughton


Trenz Electronic has developed a high-performance, industrial grade system-on-module delivering a host of advanced FPGA technologies in a compact 52mm x 76mm form factor, writes Nick Flaherty.

The TE0808 UltraSoM+ is aimed at next generation multi-tasking embedded systems in the automotive, broadcast, communications, industrial, medical, mil/aero, and T&M markets, integrating Xilinx’s Zynq UltraScale+ multi-processor system on chip (MPSoC) with up to 4GB of DDR4 SDRAM main memory with 32-bit width, up to 512MB of Flash memory for configuration and operation, and assembly options to add additional volatile or non-volatile memory.

The module supports Micron’s XTRMFlash and Spansion/Cypress HyperRAM or HyperFlash devices, and also integrates an onboard switch-mode power delivery subsystem that includes 14 DC/DC converters and 13 LDO regulators controlled by an ultra-low power MCU to provide flexible power-saving modes. Rugged board-to-board stacking connectors provide a total of 480 terminals supporting high-speed transceiver I/Os to the processing system and programmable logic in the FPGA part. An ultra-low jitter PLL provides all required clocks to the 20 serial transceivers.

With the Zynq UltraScale+ MPSoC as its processing engine, the TE0808 UltraSoM+ system-on-module provides design engineers with a programmable heterogeneous multiprocessing environment for the development of next-generation embedded systems. Such systems include 5G wireless, advanced driver assistance systems (ADAS), and industrial IoT applications. It delivers scalability through a flexible 32/64-bit data-width processing system. The system can offload critical applications like graphics and video pipelining to dedicated processing blocks, as well as turn blocks on and off through efficient power domains and gated power islands.

With a wide range of connectivity options, DSP architectural blocks, on-chip memory, and programmable logic capacity, it is aimed at for cost-sensitive, single platform, high-performance applications using industry-standard tools. In addition, the upcoming UltraITX+ companion baseboard enables the TE0808 UltraSoM+ to be installed in standard PC enclosures.

“The TE0808 UltraSoM+ is the first implementation of the Zynq UltraScale+ MPSoC in a system-on-module,” said Thorsten Trenz, CEO of Trenz Electronic. “In many ways, the technological advantage it delivers is so significant that it is hard to scope. It gives design engineers the technical edge they have been looking for as they grapple with the significant demands of developing the next generation of multi-tasking embedded systems.”









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