Stencil solution for ultra fine-pitch printing

Paul Boughton

DEK has announced the launch of its VectorGuard Platinum stencil technology. The new technology provides semiconductor manufacturers with a solution for a diverse range of next-generation challenges.

Micro-engineered to expertly meet the challenges of fine-pitch printing, VectorGuard Platinum is an enabling stencil platform for advanced applications such as wafer level packaging, direct chip attach, flip chip and ball grid arrays (BGAs).

Capable of delivering aperture accuracies of less than 3μm, and positional tolerances of better than 20μm at pitches down to 50 μm, VectorGuard Platinum’s novel stencil manufacturing process enables optimal process efficiency by generating high accuracy paste transfer and consistent paste volume repeatability.

DEK’s latest product launch represents the first time the company’s Platinum customers have been able to take advantage of the patented frameless VectorGuard stencil system. Designed for print process optimisation and first pass yield, the lightweight and compact technology offers simple and automatic tensioning, independent of traditional pneumatic assistance processes.

Delivering enhanced positional accuracy, stencil lifetime, storage convenience, improved rigidity, safer handling and breakthrough ease-of-use, the VectorGuard system extends manufacturing flexibility through an extensive selection of diverse foil technologies including VectorGuard Silver for optimal lead-free printing and VectorGuard PumpPrint for cost-effective adhesive deposition.

 For more information, visit www.dek.com.