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Silicon demand rebounds in 2010, led by 300mm wafers

iSuppli forecasts that 300mm wafers will reach 6.1 billion total square inches of silicon manufactured by 2013

Pick-and-place system dispenses solder paste of 100µm diameters

Flexible SMT production has reached new dimensions. Pick-and-place machines have now expanded their applications to include complex dispensing tasks. Such combined placement/dispensing machines can produce products at lower costs than individual specific machines. Adrian Scharli reports

High parallel vertical probe card applications

For applications such as DDR3 memory, the requirements for the flatness of boards at wafer level testing become crucial

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