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ITCM designs and develops special-purpose machinery and production processes with core strengths in web processing, powder dosing, novel packaging and high-speed assembly automation.



 

Electronics Engineer - PCB Assembly


Increased interconnection density with new PCB
 

Increased interconnection density with new PCB

New from Aerco is the HDLP range of low profile, high density, rectangular PCB connectors from Hypertac that is designed for use in applications where small, low mating force connectors with low and stable contact resistance are required.

The Hypertac HDLP connectors offer up to 2,000 mating cycles, excellent fretting corrosion resistance and are sealed to IP67 when mated.

They are particularly suitable for missile guidance and propulsion systems, ruggedised computer systems, cameras, display systems, communications panels and enclosures.

Standard configurations are 30, 58, 90 and 118-way and the HDLP series is available in variants that include PCB-to-PCB, PCB-to-flying-lead and PCB-to-flex.  PCB-to-PCB options include stacking and card-edge versions to provide additional design flexibility and interfacial seals and encapsulated contacts ensure a high level of sealing.

Use of Hypertac’s hyperboloid contact technology reduces contact resistance and achieves low mating and unmating forces with high reliability and excellent levels of shock and vibration resistance.  Hyperboloid technology provides up to 1A per contact at 110V DC allowing higher connection density than is attained by other systems. 

All connectors in the HDLP range are available in surface mount or through-hole versions and are designed for use with pick-and-place machinery.

HDLP

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