High parallel vertical probe card applications
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its UltraFlat process meets the requirements of high parallel vertical probe card applications.For applications such as DDR3 memory, the requirements for the flatness of boards at wafer level testing become crucial. For optimising MLO/MLC attachments and contact element interfaces, a better surface is needed.
Additionally, flatter PCBs require less compliance from the probe interface and reduce interface wear.
Leveraging the knowledge of PCB stack up engineering and PCB construction, Multitest developed the new UltraFlat process to meet these requirements. UltraFlat™ allows for a very tight overall flatness tolerance to be maintained by removing the bow/twist in the PCB.
Unlike 'flat-baking' that provides a temporarily flat PCB, Mutltitest’s UltraFlat process provides a permanent overall flatness for the PCB.
With UltraFlat, Multitest typically is able to comply with bow/twist requirements of 1.0 per cent.
For more information, visit www.multitest.com/pcb
