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ITCM designs and develops special-purpose machinery and production processes with core strengths in web processing, powder dosing, novel packaging and high-speed assembly automation.



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Electronics Engineer - PCB Assembly


Directional ionising nozzles provide localised static control

New Go Stat 4000 series DC ionising air nozzles from Static Solutions provide directional static control and particle dispersion when used individually or in arrays
MORE »

Precision dissolvable spacers

Designed to maintain consistent spacing between printed circuit boards and PCB components
MORE »

Moisture-curing silicone conformal coating sets fast

New from Master Bond is a fast-curing silicone conformal coating for sensitive electronics destined for use in harsh environments MORE »

Fanless Nano x86 board for high temperature range

Fanless VIA EPIA N700-10EW is guaranteed to maintain absolute stability at temperatures ranging from -20o to 70oC for environments that traditionally inhibit x86 computing MORE »

23/07/2009 - CompactPCI processor board with enhanced storage

18/06/2009 - Mass interconnect systems help protect company investment

17/06/2009 - Latest PCB technology boosts power electronics performance

16/06/2009 - Replacing PCs and SBCs with a low power embedded platform

15/06/2009 - ST launches world's thinnest accelerometer

03/06/2009 - Triple current measurement in single housing

18/02/2009 - Portable Ethernet chassis available in smaller version

02/02/2009 - Software impacts on design for multi-core processors in single chip

26/01/2009 - Modular electronics housing system for individual electronics assemblies

24/11/2008 - Faster handling of prepared production data

08/10/2008 - Printed circuit connector modules combines high density with reliability

08/10/2008 - Increased interconnection density with new PCB

19/08/2008 - Incorporating reconfigurable I/O

20/12/2007 - Design needs drive the resurgence of manufacturing in European plants

20/12/2007 - Global sourcing for European companies

20/12/2007 - 12 front slots for 160mm-deep boards

20/12/2007 - Power on board – more than just delivering high currents

20/12/2007 - Chip senses temperature, humidity, gases

20/12/2007 - Multi-core processors boost data output per watt performance

20/12/2007 - Upgrading electronic and electromechanical components

02/10/2007 - Nano-scale finish offers PCB protection

24/01/2007 - Connectors take power and signals

04/01/2007 - smaller connectors, higher performance

04/01/2007 - Hybrid connector with small footprint

04/01/2007 - Odd form assembly and laser solder processes are combined in one cell

04/01/2007 - Electronics industry urged to clean up its act on PCB production line

28/09/2006 - Up to 40kVA inverter power

31/07/2006 - Solder alloy improves tensile strength

20/07/2006 - 12.5 Gbps SerDes Core in 65 Nm CMOS process

06/07/2006 - Fail-safe operation for induction heating

05/07/2006 - Polymer lubricated solder paste squeegees

28/06/2006 - Seals extend time between maintenance

26/06/2006 - IBM aims for transistor speed crown

20/06/2006 - Start-up aims for powerline market

15/06/2006 - 32bit RISC cores take on 8bit in size

13/06/2006 - Processors cores built on a 65nm process

02/05/2006 - Semiconductors slow light

11/01/2006 - Photochemical milling cuts RFI screening cost

11/01/2006 - International event on lead-free electronics

11/01/2006 - Modular approach helps specify design criteria for rugged enclosures

01/07/2005 - Chip vendor moves from pure FPGA market

01/07/2005 - Thickness and composition metrology in ultra-thin structures

01/07/2005 - Nanotechnology alight' breakthrough

01/07/2005 - Making the move towards closed loop intelligent feeder systems

01/07/2005 - Leaving behind old trends in board design to beat interference

01/07/2005 - DSP jumpstart

 
 

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