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ITCM designs and develops special-purpose machinery and production processes with core strengths in web processing, powder dosing, novel packaging and high-speed assembly automation.
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Electronics Engineer - PCB Assembly
High parallel vertical probe card applications
For applications such as DDR3 memory, the requirements for the flatness of boards at wafer level testing become crucialMORE »
Pick-and-place system dispenses solder paste of 100µm diameters
Flexible SMT production has reached new dimensions. Pick-and-place machines have now expanded their applications to include complex dispensing tasks. Such combined placement/dispensing machines can produce products at lower costs than individual specific machines. Adrian Scharli reportsMORE »
