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ITCM designs and develops special-purpose machinery and production processes with core strengths in web processing, powder dosing, novel packaging and high-speed assembly automation.



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Electronics Engineer - PCB Assembly


Pick-and-place system dispenses solder paste of 100µm diameters

Flexible SMT production has reached new dimensions. Pick-and-place machines have now expanded their applications to include complex dispensing tasks. Such combined placement/dispensing machines can produce products at lower costs than individual specific machines. Adrian Scharli reports
MORE »

Profile fixture suitable for viewing changes in reflow ovens

KIC MVP uses embedded sensor technologies that accurately measure the profile of an individual PCB
MORE »

Silicon demand rebounds in 2010, led by 300mm wafers

iSuppli forecasts that 300mm wafers will reach 6.1 billion total square inches of silicon manufactured by 2013 MORE »

Vertical translation stage features submicron resolution

New from Aerotech is the Airlift 115 vertical translation stage that benefits from submicron resolution over a travel range up to 150mm and at speeds to 50mm/s MORE »

09/03/2010 - Directional ionising nozzles provide localised static control

04/02/2010 - Precision dissolvable spacers

03/09/2009 - Moisture-curing silicone conformal coating sets fast

18/08/2009 - Fanless Nano x86 board for high temperature range

23/07/2009 - CompactPCI processor board with enhanced storage

18/06/2009 - Mass interconnect systems help protect company investment

17/06/2009 - Latest PCB technology boosts power electronics performance

16/06/2009 - Replacing PCs and SBCs with a low power embedded platform

15/06/2009 - ST launches world's thinnest accelerometer

03/06/2009 - Triple current measurement in single housing

18/02/2009 - Portable Ethernet chassis available in smaller version

02/02/2009 - Software impacts on design for multi-core processors in single chip

26/01/2009 - Modular electronics housing system for individual electronics assemblies

24/11/2008 - Faster handling of prepared production data

08/10/2008 - Printed circuit connector modules combines high density with reliability

08/10/2008 - Increased interconnection density with new PCB

19/08/2008 - Incorporating reconfigurable I/O

20/12/2007 - Chip senses temperature, humidity, gases

20/12/2007 - Global sourcing for European companies

20/12/2007 - Power on board – more than just delivering high currents

20/12/2007 - 12 front slots for 160mm-deep boards

20/12/2007 - Upgrading electronic and electromechanical components

20/12/2007 - Design needs drive the resurgence of manufacturing in European plants

20/12/2007 - Multi-core processors boost data output per watt performance

02/10/2007 - Nano-scale finish offers PCB protection

24/01/2007 - Connectors take power and signals

04/01/2007 - Hybrid connector with small footprint

04/01/2007 - Electronics industry urged to clean up its act on PCB production line

04/01/2007 - smaller connectors, higher performance

04/01/2007 - Odd form assembly and laser solder processes are combined in one cell

28/09/2006 - Up to 40kVA inverter power

31/07/2006 - Solder alloy improves tensile strength

20/07/2006 - 12.5 Gbps SerDes Core in 65 Nm CMOS process

06/07/2006 - Fail-safe operation for induction heating

05/07/2006 - Polymer lubricated solder paste squeegees

28/06/2006 - Seals extend time between maintenance

26/06/2006 - IBM aims for transistor speed crown

20/06/2006 - Start-up aims for powerline market

15/06/2006 - 32bit RISC cores take on 8bit in size

13/06/2006 - Processors cores built on a 65nm process

02/05/2006 - Semiconductors slow light

11/01/2006 - Modular approach helps specify design criteria for rugged enclosures

11/01/2006 - International event on lead-free electronics

11/01/2006 - Photochemical milling cuts RFI screening cost

01/07/2005 - DSP jumpstart

01/07/2005 - Chip vendor moves from pure FPGA market

 
 

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