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ITCM designs and develops special-purpose machinery and production processes with core strengths in web processing, powder dosing, novel packaging and high-speed assembly automation.



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Electronics Engineer - Manufacturing Assembly


Cable guide caters for high-speed, multi-turn twisting

Igus is launching the Twisterband TB30 that can twist through 3000 degrees at a maximum angular rate of 720 degrees per second
MORE »

PC market hits record growth

Asian original equipment manufacturers surge as Acer closes fap with HP, says iSuppli Corp
MORE »

Solder jet printer eliminates the need for stencils

MYDATA’s MY500 ensures total control of solder paste deposition on a pad-by-pad basis MORE »

Aqueous cleaning solution designed with a pH neutral formulation

Kyzen Corporation announces precision cleaning products for the electronics and high-technology manufacturing operations MORE »

26/05/2010 - Pure CVD silicon carbide wafer carriers

21/04/2010 - Ethernet connectors are compact alternative to RJ 45

16/07/2009 - Direct liquid injection (DLI) vaporisers offer improved performance

23/06/2009 - Micro Manufacturing Conference 2009

09/04/2009 - UV curing system uses high-power LEDs

25/02/2009 - Stencil solution for ultra fine-pitch printing

12/02/2009 - A slippery slope for contract manufacturers

10/02/2009 - Even Samsung gets stung by DRAM downturn

22/01/2009 - Alcohol-free range of silicon sealants

07/01/2009 - Large-sized LCD panel shipments decline

21/12/2008 - Latin American television market goes flat panel

19/12/2008 - Receding economic tide lowers expectations for crucial system-level chips

18/12/2008 - Broad downturn expected for semiconductor industry

18/12/2008 - Excess stockpiles to cut chip industry growth

11/11/2008 - System cut costs and time-to-market for base station

27/10/2008 - HDTVs to grow to 241.2m units by 2012

21/10/2008 - Pressure gauge for ultra-pure gas applications

20/10/2008 - Increasing adhesion of high-stress films to ceramic components

09/10/2008 - New pad conditioners for 32 nanometer wafer fabrication

20/05/2008 - Wireless USB for portable devices?

15/05/2008 - Laser profile displacement sensor

24/01/2008 - Plasma panel market starts flowing again

28/09/2007 - Headstart on 300mm memory wafers

21/09/2007 - LCD TV prices rise in July

04/09/2007 - iPhone becomes leading US smart phone

31/08/2007 - Solder-free IGBT module

09/08/2007 - Electronic equipment growth slows

25/06/2007 - Zero-power display market growth

25/06/2007 - Three-Phase UPS earn Euro 501.8m in 2006

11/06/2007 - Wireless benefits plant and enterprise

06/06/2007 - South Korea could lose DRAM domination

06/06/2007 - Motion controller offers picometre resolution

06/06/2007 - Display vendors eye emerging markets

30/05/2007 - Global displays to cross $100bn threshold

29/05/2007 - OLED to make minor inroads into TV

21/05/2007 - Electromagnetic analysis software

01/05/2007 - Growth to double for European 3-phase UPS market

30/04/2007 - LCDs find place in handset markets

27/04/2007 - Eastern Europe is ‘electronics hotbed’

26/04/2007 - iSuppli trims 2007 semiconductor forecast

13/04/2007 - Telcos to spend $41 billion on equipment

26/03/2007 - High volume FPGAs for 65nm

21/03/2007 - Radioscape moves to mobile video

14/03/2007 - PMPs/MP3 players lead charge

14/03/2007 - Removable film protects screen surfaces

19/02/2007 - Telecoms fuel demand for dc power systems

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