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ITCM designs and develops special-purpose machinery and production processes with core strengths in web processing, powder dosing, novel packaging and high-speed assembly automation.



 
 

Electronics Engineer - Electronics Design


Connectors deliver 'highest current-to-space ratio'
 

Connectors deliver 'highest current-to-space ratio'

Supplier of interconnect solutions Molex Incorporated introduces a new version of its EXTreme Ten60Power High-Current Connectors. The EXTreme Ten60Power delivers up to 260A per linear inch, representing the highest current density available in the lowest profile interconnect on the market today. 

Featuring tighter pitch signal contacts than the original Molex 24-signal, 3-row (2.54mm x 2.54mm) version, the 25-signal, 5-row (2.00mm x 1.65mm) modules are suitable for all board-to-board and wire-to-board applications.  EXTreme Ten60Power modules are available in 250 or 600 volt versions, with a range of 1 to 10 power blade modules and 6 to 36 signal modules, for a maximum of up to 60A per blade. 

The contact design accommodates AC (7.50mm power pitch spacing), DC (5.50mm) and signal.  An array of module options is available, making the system highly configurable; these include three different mating lengths, end-mount, top-mount, or side-mount guide modules, voided power positions, and right-angle and vertical mount connectors for co-planar or vertical designs.

EXTreme Ten60Power connectors meet the UL 1977 current-interruption rating for hot plug applications. EXTreme Power™ products comprise EXTreme Ten60Power, EXTreme LPHPower™ and EXTreme PowerMass™ systems featuring a comprehensive selection of current densities, mechanical envelopes, mating terminations, and configurations.

For more information, visit www.molex.com/link/ext-power.html
 

 
 

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