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7th February 2012

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ITCM designs and develops special-purpose machinery and production processes with core strengths in web processing, powder dosing, novel packaging and high-speed assembly automation.



 
 

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Electronics Engineer - Components


UL-certified solid-state relay and contactor

Carlo Gavazzi says its new RG series solid-state relays and contactors are the first UL-certified devices to be available in compact 17.5mm wide housings
MORE »

Self-bunkering inductive proximity switches for welding applications

Balluff is launching the Bunkerprox, a rugged, 'self-bunkering' M18 inductive proximity sensor that can survive in welding applications without external protection
MORE »

Ultra-low-energy Bluetooth chip creates new product opportunities

CSR's uEnergy chips address the needs of ultra-low-power connected devices ranging from watches to health and wellbeing devices MORE »

High-power connector includes signal contacts

The new Han Q 4/2 industrial connector from Harting has four 40A power contacts and two 10A signal contacts MORE »

23/02/2010 - High-power connector includes signal contacts

15/02/2010 - IDC connectors help motor manufacturers migrate to aluminium

08/02/2010 - Left- and right-hand plugs in Eurostyle format

29/01/2010 - New 9-inch TFT display module with optional touch technology

26/01/2010 - 1MBd digital optocoupler is 'industry's most energy-efficient'

13/01/2010 - Zigbee interface converts standard switches to wireless devices

21/12/2009 - AS-interface slave module

19/10/2009 - Industrial connector gains Han-Quick Lock termination technology

14/08/2009 - Free RTOS and middleware evaluation

13/08/2009 - PCI express 2.0 certification for Altera Arria FPGAs

05/08/2009 - Battery fuel gauge for JEITA profile

24/07/2009 - Industrial displays benefit from wider viewing angles

23/06/2009 - Embedded system is suitable for high-speed, real-time vision

20/06/2009 - Mobilisation of embedded applications

19/06/2009 - Transceiver targets low cost antenna diversity in ISM band applications

15/06/2009 - Battle heats up for USB3.0 chips in new markets

10/06/2009 - Connectors: for space, medicine and test and measurement applications

23/03/2009 - Temperature transducers with option of AS-I communications

06/03/2009 - New waveguide switches offer manual or electrical operation

03/03/2009 - Contact cleaning system for electronics industry

27/02/2009 - New 85 Ohm addition to backplane connector system

12/02/2009 - Stand-alone Serial SRAM devices

05/02/2009 - New process could cut the cost of LEDs

30/01/2009 - Aluminium connector targets motorsport and military systems

29/01/2009 - Compact module uses the Intel Atom processor

28/01/2009 - Parameters for hermetically sealed connectors

21/01/2009 - DTV semiconductor market suffers decline in 2008

07/01/2009 - New TFT display modules for 2009

23/12/2008 - New generation of general-purpose relays

20/12/2008 - Cooling elements as front or rear panel

12/12/2008 - Smallest RF front-end solution for Wi-Fi applications

08/12/2008 - Microcontrollers with low power consumption

06/12/2008 - Light enhancing, heat dissipating silicones

05/12/2008 - Display modules feature a wider viewing angle

02/12/2008 - CPU board with 1.86GHz Intel Celeron M processor 440

02/12/2008 - A forgettable year for memory chip makers

28/11/2008 - Double stack hybrid linear actuators

13/11/2008 - Vacuum component market continues to grow

04/11/2008 - Heat sinks offer high performance and low weight

08/10/2008 - Circuit board housings for computer server system

04/09/2008 - FPGA boosts position sensor performance

27/08/2008 - Hardware interface is Can-compatible

19/08/2008 - D-subminiature reduce electrical noise

13/08/2008 - LVDTs with 4-20mA two-wire output

07/07/2008 - WiMAX optimised power modulator

07/07/2008 - Fieldbus electronics ensure efficiency

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