Adhesive withstands severe conditions
Master Bond EP11SIC is a silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity.
It offers the application convenience of a one component system in addition to flexible cure schedules so as to best meet specific processing requirements. It has superior adhesion to both metallic and nonmetallic substrates with a tensile strength greater than 6,000 psi and a tensile shear strength over 1,500 psi.
EP11SIC is tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals. It is recommended for bonding, potting, sealing and coating over the wide temperature range of -50°C to over 150°C.
Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste. The gel time at 150°C is in the order of 20-25 minutes while cure is on the order of 40-50 minutes at 175°C.
Typical performance properties include a very low volume resistivity less than 0.001 ohm-cm, a surface resistance of less than 1 ohms/square and a very robust thermal conductivity of 7.9 W/meter-°K (55 BTU/in/hr/ft2/°F).
Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic/electrical components which are expected to withstand severe service conditions. Its physical strength and toughness permit it to adjust to both mechanical and thermal stresses without damaging such components.
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